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TDA9935
Dual 14-bit, up to 160 Msample/s, 2 x interpolating Digital-to-Analog Converter (DAC)
Rev. 04 -- 17 September 2007 Product data sheet
1. General description
The TDA9935 is optimized to reduce architecture complexity and overall system cost. Thanks to its direct IF conversion capabilities, it leads dynamic performance in multi-carrier support. With an internal sampling rate up to 160 Msample/s, TDA9935 is an extremely competitive solution for WCDMA, CDMA2000 and GSM/EDGE transmitters, as well as high data rate radio services like WLL, LMDS and BWA.
2. Features
I I I I I I I I I I Dual 14-bit resolution SFDR = 80 dBc at 2.5 MHz Input data rate up to 80 Msample/s 2 x interpolation filter Output data rate up to 160 Msample/s Single 3.3 V power supply Low noise capacitor-free integrated PLL Low power dissipation HTQFP80 package Ambient temperature from -40 C to +85 C
3. Applications
I I I I Broadband wireless systems Digital radio links Cellular base stations Instrumentation
NXP Semiconductors
TDA9935
Dual 14-bit, up to 160 Msample/s, 2 x interpolating DAC
4. Ordering information
Table 1. Ordering information Package Name TDA9935HW HTQFP80 Description Version plastic thermal enhanced thin quad flat package; SOT841-1 80 leads; body 12 x 12 x 1 mm; exposed die pad Type number
5. Block diagram
TDA9935
11 to 16, 19 to 24, 27, 28
14
VCCA
U/I
60
IVIRES
I13 to I0
LATCH
14
FIR
14
DAC
73 72
IOUT IOUTN
(CLK x 2) CLK CLKN 5 6 31 to 34, 37 to 42, 45 to 48
14
CLOCK DRIVER
PLL
(CLK x 2)
INTERNAL BAND GAP
58 57
GAPOUT GAPD QOUT QOUTN
(CLK x 2) LATCH DAC
Q13 to Q0
14
FIR
14
69 68
i.c. VCCD
2, 8 10, 51
(1) (2) (3) (4)
U/I VCCA
59
QVIRES
VCCA
001aab119
AGND DGND
DEC
(1) Pins 1, 3, 61, 65, 76 and 80. (2) Pins 4, 7, 62, 64, 66, 67, 70, 71, 74, 75, 77 and 79. (3) Pins 9, 17, 25, 29, 30, 35, 44, 49, 50, 52, 53, 54, 55 and 56. (4) Pins 18, 26, 36, 43, 63 and 78.
Fig 1. Block diagram
TDA9935_4
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Product data sheet
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NXP Semiconductors
TDA9935
Dual 14-bit, up to 160 Msample/s, 2 x interpolating DAC
6. Pinning information
6.1 Pinning
68 QOUTN 72 IOUTN 69 QOUT 79 AGND 77 AGND 75 AGND 74 AGND 71 AGND 70 AGND 67 AGND 66 AGND 64 AGND 62 AGND
80 VCCA
76 VCCA
65 VCCA
73 IOUT
78 DEC
VCCA i.c. VCCA AGND CLK CLKN AGND i.c. DGND
1 2 3 4 5 6 7 8 9
63 DEC
61 VCCA 60 IVIRES 59 QVIRES 58 GAPOUT 57 GAPD 56 DGND 55 DGND 54 DGND 53 DGND 52 DGND 51 VCCD 50 DGND 49 DGND 48 Q0 47 Q1 46 Q2 45 Q3 44 DGND 43 DEC 42 Q4 41 Q5 Q6 40
001aab120
(c) NXP B.V. 2007. All rights reserved.
VCCD 10 I13 11 I12 12 I11 13 I10 14 I9 15 I8 16 DGND 17 DEC 18 I7 19 I6 20 I5 21 I4 22 I3 23 I2 24 DGND 25 DEC 26 I1 27 I0 28 DGND
TDA9935HW
DGND 29
DGND 30
Q13 31
Q12 32
Q11 33
Q10 34
DGND 35
DEC 36
Q9 37
Q8 38
Fig 2. Pin configuration
6.2 Pin description
Table 2. Symbol VCCA i.c. VCCA AGND CLK CLKN AGND i.c. DGND
TDA9935_4
Pin description Pin 1 2 3 4 5 6 7 8 9 Type[1] S I/O S G I I G O G Description analog supply voltage internally connected; leave open analog supply voltage analog ground clock input complementary clock input analog ground internally connected; leave open digital ground
Product data sheet
Rev. 04 -- 17 September 2007
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3 of 18
NXP Semiconductors
TDA9935
Dual 14-bit, up to 160 Msample/s, 2 x interpolating DAC
Pin description ...continued Pin 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 Type[1] S I I I I I I G O I I I I I I G O I I G G I I I I G O I I I I I I O G I I I I G G Description digital supply voltage I data input bit 13 (MSB) I data input bit 12 I data input bit 11 I data input bit 10 I data input bit 9 I data input bit 8 digital ground decoupling node I data input bit 7 I data input bit 6 I data input bit 5 I data input bit 4 I data input bit 3 I data input bit 2 digital ground decoupling node I data input bit 1 I data input bit 0 (LSB) digital ground digital ground Q data input bit 13 (MSB) Q data input bit 12 Q data input bit 11 Q data input bit 10 digital ground decoupling node Q data input bit 9 Q data input bit 8 Q data input bit 7 Q data input bit 6 Q data input bit 5 Q data input bit 4 decoupling node digital ground Q data input bit 3 Q data input bit 2 Q data input bit 1 Q data input bit 0 digital ground digital ground
(c) NXP B.V. 2007. All rights reserved.
Table 2. Symbol VCCD I13 I12 I11 I10 I9 I8 DGND DEC I7 I6 I5 I4 I3 I2 DGND DEC I1 I0 DGND DGND Q13 Q12 Q11 Q10 DGND DEC Q9 Q8 Q7 Q6 Q5 Q4 DEC DGND Q3 Q2 Q1 Q0 DGND DGND
TDA9935_4
Product data sheet
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NXP Semiconductors
TDA9935
Dual 14-bit, up to 160 Msample/s, 2 x interpolating DAC
Pin description ...continued Pin 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 Type[1] S G G G G G I I/O I I S G O G S G G O O G G O O G G S G O G S Description digital supply voltage digital ground digital ground digital ground digital ground digital ground internal band gap power disable input band gap output voltage Q DAC biasing resistor I DAC biasing resistor analog supply voltage analog ground decoupling node analog ground analog supply voltage analog ground analog ground complementary Q DAC output current Q DAC output current analog ground analog ground complementary I DAC output current I DAC output current analog ground analog ground analog supply voltage analog ground decoupling node analog ground analog supply voltage
Table 2. Symbol VCCD DGND DGND DGND DGND DGND GAPD GAPOUT QVIRES IVIRES VCCA AGND DEC AGND VCCA AGND AGND QOUTN QOUT AGND AGND IOUTN IOUT AGND AGND VCCA AGND DEC AGND VCCA
[1]
Type description: S: Supply; G: Ground; I: Input; O: Output.
TDA9935_4
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Product data sheet
Rev. 04 -- 17 September 2007
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NXP Semiconductors
TDA9935
Dual 14-bit, up to 160 Msample/s, 2 x interpolating DAC
7. Functional description
The DAC is a segmented architecture composed of a 7-bit thermometer sub-DAC, and the remaining 7-bit in a binary weighted sub-DAC. The device produces two complementary current outputs on both channels, respectively pins IOUT/IOUTN and QOUT/QOUTN which need to be connected via a load resistor to the ground. Figure 3 shows the equivalent analog output circuit of one DAC, which consists of a parallel combination of PMOS current sources and associated switches for each segment. The cascode source configuration enables to increase the output impedance of the source and set to improve the dynamic performance of the DAC by introducing less distortion. Figure 4 shows the internal reference configuration. In this case the bias current is given by the output of the internal regulator connected to the inverting input of the internal operational amplifiers, while external resistors RI and RQ are connected respectively to pins IVIRES and QVIRES. Thus the output current of the two DACs is typically fixed to 20 mA with an appropriate choice of these resistors. This configuration is optimal for temperature drift compensation because the band gap can be matched with the voltage on the feedback resistors. The relation between full-scale output current IO(FS) and the RI (RQ) is: 2048 x V GAPOUT R I = ----------------------------------------- 82 x I O ( FS ) The output current can also be adjusted by imposing an external reference voltage to the inverting input pin GAPOUT and disabling the internal band gap with pin GAPD set to HIGH. At a voltage lower than 1.2 V the current can be set at values lower than 20 mA. The input references at pins IVIRES and QVIRES may also be driven by separate reference voltages to adjust independently the two DAC currents.
TDA9935
GAPD AGND GAPOUT INTERNAL BAND GAP
RI
TDA9935
IOUT/QOUT RL IOUTN/QOUTN RL RQ
IVIRES
I DAC current sources array
QVIRES
Q DAC current sources array
AGND
AGND
001aab124
001aab125
Fig 3. Equivalent analog output circuit
TDA9935_4
Fig 4. Internal reference configuration
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Product data sheet
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NXP Semiconductors
TDA9935
Dual 14-bit, up to 160 Msample/s, 2 x interpolating DAC
8. Limiting values
Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCCD VCCA VCCA-CCD VI Parameter digital supply voltage analog supply voltage supply voltage difference between the analog and digital supply voltages voltage at input pins pins Qn and In referenced to DGND pins IVIRES, QVIRES and GAPD referenced to AGND pins CLK and CLKN referenced to AGND VO Tstg Tamb Tj
[1]
Conditions
[1] [1]
Min -0.3 -0.3 -150 -0.3 -0.3 -0.3 -0.3 -55 -40 -
Max +3.9 +3.9 +150
Unit V V mV
VCCD + 0.3 V VCCA + 0.3 V VCCA + 0.3 V VCCA + 0.3 V +150 +85 125 C C C
voltage at output pins storage temperature ambient temperature junction temperature
All supplies are connected together.
pins IOUT, IOUTN, QOUT and QOUTN referenced to AGND
9. Thermal characteristics
Table 4. Symbol Rth(j-a) Rth(c-a) Thermal characteristics Parameter thermal resistance from junction to ambient thermal resistance from case to ambient Conditions in free air in free air Typ 27.1 11.8 Unit K/W K/W
TDA9935_4
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Product data sheet
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NXP Semiconductors
TDA9935
Dual 14-bit, up to 160 Msample/s, 2 x interpolating DAC
10. Characteristics
Table 5. Characteristics VCCD = VCCA = 3.0 V to 3.6 V; AGND and DGND connected together; Tamb = -40 C to +85 C; typical values measured at VCCD = VCCA = 3.3 V, IO(FS) = 20 mA and Tamb = 25 C; dynamic parameters measured using output schematic given in Figure 10; unless otherwise specified. Symbol Supplies VCCD VCCA ICCD ICCA Ptot digital supply voltage analog supply voltage digital supply current analog supply current total power dissipation fCLK = 80 Msample/s; fIOUT = fQOUT = 5 MHz 3.0 3.0 3.3 3.3 55 73 422 3.6 3.6 65 85 540 V V mA mA mW Parameter Conditions Min Typ Max Unit
Clock inputs (CLK and CLKN) VI(CM) VCLK common mode input voltage differential input voltage swing full-scale output current output resistance output capacitance LOW-level input voltage HIGH-level input voltage LOW-level input current HIGH-level input current output voltage output current output voltage drift maximum clock rate clock HIGH pulse width clock LOW pulse width input hold time input setup time external voltage VIL = 0.3VCCD VIH = 0.7VCCD differential outputs
[1] [1]
-
1.65 1.0
-
V V
Analog outputs (IOUT, IOUTN, QOUT and QOUTN) IO(FS) Ro Co VIL VIH IIL IIH VGAPOUT IGAPOUT VGAPOUT fCLK(max) tW(CLKH) tW(CLKL) th(i) tsu(i) 4 DGND 80 5 5 1.1 -1.5 150 3 5 5 1.31 1 133 20 mA k pF
Digital inputs (I0 to I13, Q0 to Q13 and GAPD) 0.3VCCD V VCCD 3.4 +0.7 V A A V A ppm/C Msample/s ns ns ns ns 0.7VCCD -
Reference voltage output (GAPOUT)
Clock timing inputs (CLK and CLKN)
Input timing (I0 to I13 and Q0 to Q13); see Figure 5
TDA9935_4
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Product data sheet
Rev. 04 -- 17 September 2007
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NXP Semiconductors
TDA9935
Dual 14-bit, up to 160 Msample/s, 2 x interpolating DAC
Table 5. Characteristics ...continued VCCD = VCCA = 3.0 V to 3.6 V; AGND and DGND connected together; Tamb = -40 C to +85 C; typical values measured at VCCD = VCCA = 3.3 V, IO(FS) = 20 mA and Tamb = 25 C; dynamic parameters measured using output schematic given in Figure 10; unless otherwise specified. Symbol N fI(D) RPBW PBW SBR td(g) INL DNL In(o) Eoffset(o) EG MG SFDR Parameter order data input rate ripple in pass bandwidth pass bandwidth stop band rejection group delay time integral non-linearity differential non-linearity output noise current output offset error gain error gain matching spurious-free dynamic range relative to full scale relative to full scale between I and Q, relative to full scale fCLK = 80 Msample/s; BW = Nyquist fOUT = 2.5 MHz at 0 dBFS fOUT = 5 MHz at 0 dBFS fOUT = 13 MHz at 0 dBFS H2 H3 IMD2 second harmonic third harmonic second order two-tone intermodulation rejection third order two-tone intermodulation rejection total harmonic distortion fOUT = 5 MHz fOUT = 13 MHz fOUT = 5 MHz fOUT = 13 MHz fCLK = 80 Msample/s; fOUT1 = 10 MHz; fOUT2 = 12 MHz; BW = Nyquist fCLK = 80 Msample/s; fOUT1 = 10 MHz; fOUT2 = 12 MHz fCLK = 80 Msample/s; BW = Nyquist fOUT = 2.5 MHz fOUT = 5 MHz (Tamb = 25 C) NSD noise spectral density fCLK = 80 Msample/s fOUT = 2.5 MHz fOUT = 5 MHz fOUT = 19 MHz -155 -155 -153 dBm/Hz dBm/Hz dBm/Hz 68 75 71 dBc dBc 80 72 64 73 65 88 86 65 dBc dBc dBc dBc dBc dBc dBc dBc fdata/fCLK; 0.005 dB attenuation fdata/fCLK; 3 dB attenuation fdata/fCLK = 0.6 to 1 Conditions Min 80 -5.4 Typ 42 0.405 0.479 69 11TCLK 2.9 1.5 120 -0.3 0.2 Max +5.4 dB ns LSB LSB pA/Hz % % % Msample/s Unit Digital filter specification (FIR); see Figure 6, Figure 7 and Table 7
Analog signal processing
IMD3 THD
-
84
-
dBc
TDA9935_4
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Product data sheet
Rev. 04 -- 17 September 2007
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NXP Semiconductors
TDA9935
Dual 14-bit, up to 160 Msample/s, 2 x interpolating DAC
Table 5. Characteristics ...continued VCCD = VCCA = 3.0 V to 3.6 V; AGND and DGND connected together; Tamb = -40 C to +85 C; typical values measured at VCCD = VCCA = 3.3 V, IO(FS) = 20 mA and Tamb = 25 C; dynamic parameters measured using output schematic given in Figure 10; unless otherwise specified. Symbol S/N Parameter signal-to-noise ratio Conditions fCLK = 80 Msample/s; BW = Nyquist fOUT = 2.5 MHz fOUT = 5 MHz fOUT = 19 MHz ACPR adjacent channel power ratio baseband; 5 MHz channel spacing; BW = 3.4 MHz fOUT = 2.5 MHz fOUT = 20 MHz
[1] Guaranteed by design.
Min
Typ
Max
Unit
70 -
80 80 78
-
dBc dBc dBc
-
69 71
-
dBc dBc
Table 6. LOW HIGH
Band gap Band gap input/output (GAPOUT) output (VGAPOUT = 1.2 V) input Internal band gap enable disable
Band gap disable (GAPD)
tsu(i)
I0 to I13, Q0 to Q13
CLKN CLK
th(i)
50 %
IOUT/IOUTN, QOUT/QOUTN
001aab121
Fig 5. Input timing diagram
TDA9935_4
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Product data sheet
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NXP Semiconductors
TDA9935
Dual 14-bit, up to 160 Msample/s, 2 x interpolating DAC
20 output (dB) -20
001aab122
0.6 normalized output
001aab123
0.4 -60 0.2 -100 0
-140
-180 0 0.2 0.4 0.6 0.8 1.0 normalized frequency (fOUT/fCLK)
-0.2 0 10 20 30 t (sample) 40
Fig 6. FIR filter frequency response Table 7. H(1) H(2) H(3) H(4) H(5) H(6) H(7) H(8) H(9) H(10) H(11) H(12) H(13) H(14) H(15) H(16) H(17) H(18) H(19) H(20) H(21) H(22)
Fig 7. FIR filter impulse response
Interpolation FIR filter coefficient Coefficient H(43) H(42) H(41) H(40) H(39) H(38) H(37) H(36) H(35) H(34) H(33) H(32) H(31) H(30) H(29) H(28) H(27) H(26) H(25) H(24) H(23) Value 10 0 -31 0 69 0 -138 0 248 0 -419 0 678 0 -1083 0 1776 0 -3282 0 10364 16384
Coefficient
TDA9935_4
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Product data sheet
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NXP Semiconductors
TDA9935
Dual 14-bit, up to 160 Msample/s, 2 x interpolating DAC
11. Application information
AGND
TDA9935
1 k 100 nF
CLK
TDA9935
Rs
CLK VCCA
100 nF
1 k
VCCA AGND
1 k
Vth
1 k
100 nF
CLKN
100 nF
1 k
CLKN
1 k
AGND
001aab126
AGND
001aab127
Fig 8. Single-ended clock schematic
Fig 9. Differential clock schematic
TDA9935_4
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Product data sheet
Rev. 04 -- 17 September 2007
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TDA9935
Dual 14-bit, up to 160 Msample/s, 2 x interpolating DAC
50 (RLOAD)
50 (RLOAD)
1:1 AGND AGND
50 50 C
1:1 AGND AGND
50 50 C
AGND AGND AGND AGND 3.3 V
C C
AGND AGND AGND AGND AGND 3.3 V
C C
3.3 V
C
3.3 V
C
QOUTN
IOUTN
QOUT
AGND
AGND
AGND
AGND
AGND
AGND
AGND
AGND
AGND
AGND
VCCA
VCCA
VCCA
3.3 V
C
VCCA i.c. VCCA
C
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 60 59 58 57 56 55 54 53 52 51
VCCA
IOUT
DEC
DEC
IVIRES QVIRES GAPOUT GAPD DGND DGND DGND DGND DGND VCCD DGND DGND Q0 Q1 Q2 Q3 DGND DEC Q4 Q5
1.5 k 1.5 k
3.3 V AGND
AGND CLK CLKN
C
AGND
AGND
AGND i.c.
DGND
C
DGND VCCD I13 I12 I11 I10 I9 I8
DGND 3.3 V
C
3.3 V
TDA9935
50 49 48 47 46 45 44 43 42
DGND
DGND
C
DGND DEC I7 I6
C
DGND
41 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 I5 I4 I3 I2 I1 I0 Q13 Q12 Q11 Q10 Q9 Q8 Q7 DGND DEC DGND DGND DGND DEC Q6
C
C
DGND
DGND
DGND
001aab495
All resistors are 1 % precision resistors. C = 100 nF.
Fig 10. Application diagram
TDA9935_4
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Product data sheet
Rev. 04 -- 17 September 2007
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NXP Semiconductors
TDA9935
Dual 14-bit, up to 160 Msample/s, 2 x interpolating DAC
12. Package outline
HTQFP80: plastic thermal enhanced thin quad flat package; 80 leads; body 12 x 12 x 1 mm; exposed die pad SOT841-1
c y exposed die pad X
Dh 60 61 41 40 ZE
A
e Eh w bp
M
E
HE
A A2
(A 3) A1 detail X L Lp
pin 1 index 80 1 w D HD
M
21 20 ZD B v
M
v
M
A
e
bp
B
0 DIMENSIONS (mm are the original dimensions) UNIT mm A max 1.2 A1 0.15 0.05 A2 1.05 0.95 A3 0.25 bp 0.27 0.17 c 0.20 0.09 D (1) 12.1 11.9 Dh 6.05 5.95 E (1) 12.1 11.9 Eh 6.05 5.95
5 scale
10 mm
e 0.5
HD
HE
L 1
Lp 0.75 0.45
v 0.2
w 0.08
y 0.1
ZD(1) ZE(1) 1.45 1.05 1.45 1.05
7 0
14.15 14.15 13.85 13.85
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included OUTLINE VERSION SOT841-1 REFERENCES IEC JEDEC MS-026 JEITA EUROPEAN PROJECTION ISSUE DATE 04-01-15
Fig 11. Package outline SOT841-1 (HTQFP80)
TDA9935_4 (c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 -- 17 September 2007
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TDA9935
Dual 14-bit, up to 160 Msample/s, 2 x interpolating DAC
13. Abbreviations
Table 8. Acronym BW BWA CDMA EDGE FIR IF LMDS LSB MSB PLL PMOS SFDR WCDMA WLL Abbreviations Description BandWidth Broadband Wireless Access Code Division Multiple Access Enhanced Data rates for GSM Evolution Finite Impulse Response Intermediate Frequency Local Multipoint Distribution Service Least Significant Bit Most Significant Bit Phase-Locked Loop Positive-Metal Oxide Semiconductor Spurious-Free Dynamic Range Wideband Code Division Multiple Access Wireless Local Loop
14. Glossary
14.1 Static parameters
DNL -- Differential Non-Linearity. The difference between the ideal and the measured output value between successive DAC codes. INL -- Integral Non-Linearity. The deviation of the transfer function from a best-fit straight line (linear regression computation).
14.2 Dynamic parameters
IMD2 -- Two-tone InterModulation Distortion rejection; Second order. From a dual-tone digital input sine wave (these two frequencies are close together), the intermodulation distortion product IMD2 is the ratio of the RMS value of either tone and the RMS value of the worst 2nd-order intermodulation product. IMD3 -- Two-tone InterModulation Distortion rejection; Third order. From a dual-tone digital input sine wave (these two frequencies are close together), the intermodulation distortion product IMD3 is the ratio of the RMS value of either tone and the RMS value of the worst 3rd-order intermodulation product. SFDR -- Spurious-Free Dynamic Range. The ratio between the RMS value of the reconstructed output sine wave and the RMS value of the largest spurious observed (harmonic and non-harmonic, excluding DC component) in the frequency domain. S/N -- Signal-to-Noise ratio. The ratio of the RMS value of the reconstructed output sine wave to the RMS value of the noise excluding the harmonics and the DC component.
TDA9935_4
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Product data sheet
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TDA9935
Dual 14-bit, up to 160 Msample/s, 2 x interpolating DAC
THD -- Total Harmonic Distortion. The ratio of the RMS value of the harmonics of the output frequency to the RMS value of the output sine wave. Usually, the calculation of THD is done on the first 5 harmonics.
15. Revision history
Table 9. Revision history Release date 20070917 Data sheet status Product data sheet Product data sheet Change notice Supersedes TDA9935_3 TDA9935_2 Document ID TDA9935_4 Modifications: TDA9935_3 Modifications:
* * * *
Amended the (alternative) descriptive title The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Extended abbreviations list in Section 13. Preliminary data sheet Objective data sheet TDA9935_1 -
20070611
TDA9935_2 TDA9935_1 (9397 750 13346)
20060809 20041214
TDA9935_4
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Product data sheet
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TDA9935
Dual 14-bit, up to 160 Msample/s, 2 x interpolating DAC
16. Legal information
16.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
16.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
17. Contact information
For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com
TDA9935_4
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 -- 17 September 2007
17 of 18
NXP Semiconductors
TDA9935
Dual 14-bit, up to 160 Msample/s, 2 x interpolating DAC
18. Contents
1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 14.1 14.2 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7 Thermal characteristics. . . . . . . . . . . . . . . . . . . 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Application information. . . . . . . . . . . . . . . . . . 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Static parameters . . . . . . . . . . . . . . . . . . . . . . 15 Dynamic parameters. . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 17 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Contact information. . . . . . . . . . . . . . . . . . . . . 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 17 September 2007 Document identifier: TDA9935_4

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